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摘要：本文分3部分刊出。第一部分回顧了國內(nèi)鋼鐵件HEDP直接鍍銅工藝的開發(fā)歷程以及國內(nèi)外HEDP無氰鍍銅的工業(yè)應(yīng)用狀況。分析了HEDP、檸檬酸鹽、焦磷酸鹽和氰化物作為堿性鍍銅配位劑的優(yōu)缺點(diǎn)。結(jié)合近30年來的生產(chǎn)實(shí)踐，認(rèn)為HEDP還是目前堿性無氰鍍銅的首選配位劑。
關(guān)鍵詞：鋼鐵；鍍銅；l-羥基乙叉一1，1一二膦酸；配位劑
中圖分類號：TQl53．14 文獻(xiàn)標(biāo)志碼：A
文章編號：1004-227X(2009)09-0007-04
Renew of HEDP direct copper plating process on iron and steel workpiece aRer 30 years of development-- Part L History and recent 30 years of improvement／／ FANG Jing-Li
Abstract：This paper is to be published in three parts．In the first part，the development history of HEDP direct copper plating process in China and its industrial applications at home and aboard were reviewed．The advantages and disadvantages of chelating agents HEDP，citrate，pyrophosphate and cyanide used for alkaline copper plating were analyzed， based on 30 years of production practice．It is considered that，for the time being，HEDP is the preferred chelating agent for alkaline copper plating in replace of cyanide．
Keywords：iron and steel；copper plating；1-hydroxy- ethylidene-1，1-diphosphonic acid；chelating agent
Author"S address：Fuzhou Nobel Surface Technology Ltd， Fuzhou Jinshan Incubator of Technology Enterprises，The Second floor，N0．3 Building，Fuzhou 350003，China
鋼鐵件HEDP直接鍍銅工藝開發(fā)30年回顧：從焦磷酸鹽鍍銅的頑強(qiáng)生命力可見HEDP鍍銅的光輝前景
